• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention significantly reduces the frequency of use of ferric chloride and significantly reduces the incidence of sludge residues generated thereby, and significantly reduces the amount of waste liquid generated after the etching of the substrate raw material is completed, thereby making it more environmentally friendly. Its purpose is to provide a method of manufacturing a printed circuit board which can greatly contribute to the manufacturing process of the printed circuit board. The present invention for achieving the above object is an etching process for removing the unwanted portion of the conductive layer by inserting the substrate raw material with the conductive layer formed through the circuit ink in the etching vessel of the ferric chloride (FeCl 3 ) containing the ferric chloride In the method of manufacturing a printed circuit board comprising a ferric chloride (FeCl 3 ) in accordance with the amount of the hydrochloric acid solution and water, characterized in that the appropriate amount is added to the etching vessel.
    公开号:KR20000059202A
    申请号:KR1020000041993
    申请日:2000-07-21
    公开日:2000-10-05
    发明作者:이재국
    申请人:이재국；서한산업 주식회사；
    IPC主号:
    专利说明:

    Manufacturing Method of Printed Circuit Board {A METHOD FOR MANUFACTURING OF PRINTED CIRCUIT BOARD}
    The present invention relates to a method for manufacturing a printed circuit board, which significantly reduces the frequency of use of ferric chloride and significantly reduces the incidence of sludge residues generated by the ferrous chloride. The present invention relates to a method for manufacturing a printed circuit board which significantly reduces the amount, thereby greatly contributing to the manufacturing process of a more environmentally friendly printed circuit board.
    In recent years, the electronic industry has been increasingly adopting a mounting technology using multilayer printed circuit boards, which are capable of high density, high precision, and high integration, in order to reduce the size and thickness of electronic devices. There are many fields such as factory automation (OA) equipment, office automation (OA) equipment, communication equipment, broadcasting equipment, portable computers, and the like that use the multilayer printed circuit board.
    In particular, as the miniaturization and thinning of the mobile communication device and the digital consumer electronics market are rapidly progressing, the demand for multilayer printed circuit boards is rapidly increasing.
    Also, with the recent development of Chip Size Package (CSP) technologies such as μBGA (Ball Grid Array) and Tape Carrier Package (TCP), interest in high-density printed circuit boards capable of mounting such chips is increasing.
    The process of manufacturing the multilayer printed circuit board goes through a process similar to the existing single-sided or double-sided printed circuit board manufacturing process.
    That is, after forming the conductive layer through coating or inking a circuit ink or copper foil, unwanted portions are removed using an etching process and only the desired circuit portion remains.
    On the other hand, the above-described etching process is carried out while transferring the printed circuit board one by one into the corrosion machine containing FeCl 3 (ferric chloride) of about 38% to 41% concentration.
    However, in the aforementioned conventional etching process, when the printed circuit board is etched (corroded) about 250 sheets, the corrosion function of the ferric chloride is lost, and the new ferric chloride is refilled after the removal of the ferric chloride. Ferric chloride is used until it corrodes 250 printed circuit boards.
    Therefore, in the conventional etching process, since the ferric chloride must be periodically replaced as described above, there is a problem that the amount of use is increased.
    In addition, as a large amount of ferric chloride is used, a lot of sludge residues are generated to block the nozzles of the etching vessel, and there is also a problem that causes a lot of waste liquid to cause environmental pollution.
    The present invention was devised to solve the above problems, significantly reducing the frequency of use of ferric chloride, and significantly reducing the occurrence frequency of sludge residues, which is generated after the completion of etching of substrate raw materials. It is an object of the present invention to provide a method of manufacturing a printed circuit board, which significantly reduces the amount of waste liquid, thereby greatly contributing to the manufacturing process of a more environmentally friendly printed circuit board.
    The present invention for achieving the above object is an etching process for removing the unwanted portion of the conductive layer by inserting the substrate raw material with the conductive layer formed through the circuit ink in the etching vessel of the ferric chloride (FeCl 3 ) containing the ferric chloride In the method of manufacturing a printed circuit board comprising a ferric chloride (FeCl 3 ) in accordance with the amount of the hydrochloric acid solution and water, characterized in that the appropriate amount is added to the etching vessel.
    Hereinafter, the manufacturing method of the printed circuit board according to the present invention will be described in detail.
    In the method of manufacturing a printed circuit board according to the present invention, a conductive layer is formed on the substrate raw material through plating.
    Subsequently, a predetermined amount of ferric chloride (FeCl 3 ) solution, which maintains a predetermined concentration, is added to an etching vessel (not shown) of the corrode (not shown), and then hydrochloric acid is added according to the amount of ferric chloride (FeCl 3 ) solution added thereto. A solution and water are introduced into the etching vessel in a predetermined amount.
    Here, the amount of ferric chloride solution: the amount of hydrochloric acid solution: the amount of water is preferably in a ratio of a: b: c to prevent over-corrosion and non-corrosion.
    After performing all the above processes, when the mixed etching solution is sprayed onto the substrate raw material from the nozzle (not shown) of the etching vessel, etching is performed to remove unwanted portions of the conductive layer. Only the desired portion remains in the circuit pattern.
    For example, when manufacturing a printed circuit board, the concentration of ferric chloride should be 38% to 41%, but the amount of ferric chloride is 1000ℓ, the amount of hydrochloric acid solution is 20ℓ of ferric chloride, 20ℓ, and the amount of water is 150ℓ of ferric chloride. In this case, up to 250 substrate raw materials could be worked.
    Here, the reason why the circuit pattern is formed in the substrate raw material is possible due to the corrosive action of the ferric chloride (FeCl 3 ) solution contained in the etching vessel and the chemical reaction with the hydrochloric acid solution and water.
    That is, the hydrochloric acid solution and water play a role in activating the corrosion function of the ferric chloride solution in which the corrosion function decreases as the number of etching of the substrate raw material increases.
    On the other hand, after etching the substrate raw material to an appropriate number of sheets, for example, 250 sheets as described above, the ferric chloride contained in the etching vessel gradually loses its function and thereby generates sludge residues.
    A predetermined amount of hydrochloric acid solution is further added to the etching vessel in order to prevent such loss of function and generation of sludge residues.
    That is, since the sludge residue blocks the nozzle of the etching vessel, the hydrochloric acid solution serves to remove the sludge residue as a result.
    Here, it is preferable that the amount of hydrochloric acid solution additionally added is approximately equal to the amount of hydrochloric acid solution initially added to the etching vessel. The reason why the initial input amount and the additional input amount are the same is to prevent over corrosion or non-corrosion of the conductive layer of the substrate raw material.
    As described above, when an additional hydrochloric acid solution is added to the etching vessel (about 20 liters in the actual operation) and the substrate raw material is etched, approximately 200 sheets of the substrate raw material can be etched.
    As described above, after the substrate raw material is etched to about 450 sheets, only a small amount of sludge residue in the etching vessel is left behind to prevent the nozzle.
    After etching the substrate raw materials up to about 450 sheets as described above, the ferric chloride contained in the etching vessel gradually loses its function and generates a predetermined amount of sludge residue, although not enough to close the nozzle.
    In order to prevent such a phenomenon, a predetermined amount of hydrochloric acid solution is further added to the etching vessel.
    As described above, when the hydrochloric acid solution is additionally added to the etching vessel (about 20 L in actual operation) and the substrate raw material is etched, approximately 200 further substrate raw materials can be etched.
    On the other hand, the additional addition of an appropriate amount of hydrochloric acid solution into the etching vessel each time the appropriate number of etching of the substrate raw material according to the amount of ferric chloride initially added, as well as the secondary, tertiary and quaternary Of course, it can be repeated more than that.
    Herein, the hydrochloric acid solution is added to the etching vessel and reacted with ferric chloride to dilute the added amount without remaining intact.
    That is, even though a predetermined amount of hydrochloric acid solution was added to the etching vessel three times, when the final etching operation was finished and the amount of the mixed solution contained in the etching vessel was checked, only the amounts corresponding to the ferric chloride solution and water remained. The incidence of is significantly reduced compared with the prior art.
    In addition, after etching a total of 650 sheets of substrate raw materials, the amount of sludge waste generated in the etching vessel is significantly reduced.
    As described above, according to the present invention, the frequency of use of ferric chloride is significantly reduced, and the incidence of sludge residues generated thereby is significantly reduced, and the amount of waste liquid generated after the completion of etching of substrate raw materials is remarkably reduced. This can greatly contribute to the manufacturing process of more environmentally friendly printed circuit boards.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] A method of manufacturing a printed circuit board comprising an etching step of removing an unwanted portion of the conductive layer by inserting a substrate raw material having a conductive layer formed therein through plating in an etching vessel of a ferric chloride containing FeCl 3 .
    Method for producing a printed circuit board, characterized in that the appropriate amount of the hydrochloric acid solution and water are added to the etching vessel according to the amount of ferric chloride (FeCl 3 ).
    [2" claim-type="Currently amended] The method of manufacturing a printed circuit board according to claim 1, wherein an additional amount of hydrochloric acid solution is additionally added to the etching vessel every time the substrate raw material is etched.
    [3" claim-type="Currently amended] The method of claim 1, wherein the amount of ferric chloride solution: the amount of hydrochloric acid solution: the amount of water is 100: 2: 15.
    [4" claim-type="Currently amended] The method of manufacturing a printed circuit board according to claim 1 or 2, wherein the amount of hydrochloric acid solution further added into the etching vessel is equal to the amount of hydrochloric acid solution initially added.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-07-21|Application filed by 이재국, 서한산업 주식회사
    2000-07-21|Priority to KR1020000041993A
    2000-07-21|Priority claimed from KR1020000041993A
    2000-10-05|Publication of KR20000059202A
    2002-10-25|Application granted
    2002-10-25|Publication of KR100357719B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR1020000041993A|KR100357719B1|2000-07-21|A method for manufacturing of printed circuit board|
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